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TLP700 2010-02-23 1 unit in mm weight: 0.26 g (t y p .) 4.580.25 4.0 +0.25 ? 0.20 9.70.3 6.80.25 0.40.1 1.270.2 1.250.25 7.620.25 3.65 +0.15 ? 0.25 0.25 1 2 3 6 5 4 11-5j1 toshiba 11-5j1 ? 0.05 +0.10 toshiba photocoupler gaa ? as ir ed + photo ic TLP700 industrial inverters inverter for air conditioners igbt/power mosfet gate drive TLP700 consists of a gaa ? as light-emitting diode and an integrated photodetector. this unit is 6-lead sdip package. the TLP700 is 50% smaller than the 8-pin dip and meets the reinforced insulation clas s requirements of international safety standards. therefore the mounting area can be reduced in equipment requiring safety standard certification. the TLP700 is suitable for gate driving circuits for igbts or power mosfets. in particular, the TLP700 is capable of ?direct? gate driving of low-power igbts. ? peak output current: 2.0 a (max) ? guaranteed performanc e over temperature: ? 40 to 100c ? supply current: 2 ma (max) ? power supply voltage: 15 to 30 v ? threshold input current: i flh = 5 ma (max) ? switching time (t p lh / t p hl ): 500 ns (max) ? common mode transient immunity: 15 kv/ s (min) ? isolation voltage: 5000 vrms (min) ? construction mechanical rating 7.62-mm pitch standard type 10.16-mm pitch tlpxxxf type creepage distance clearance insulation thickness 7.0 mm (min) 7.0 mm (min) 0.4 mm (min) 8.0 mm (min) 8.0 mm (min) 0.4 mm (min) ? ul recognized: ul1577, file no. e67349 ? option (d4) type tv approved: en60747-5-2 maximum operating insulation voltage: 890 v pk highest permissible over voltage: 8000 v pk ( note ) when a en60747-5-2 approved type is needed, please designate the ?option(d4)? truth table input led m1 m2 output h on on off h l off off on l 1: anode 2: n.c 3: cathode 4: gnd 5: v o ( output ) 6: v cc 1 3 4 5 6 2 shield pin configuration (top view) a 0.1- f bypass capacitor must be connected between pins 6 and 4. (see note 6.) schematic v cc gnd i cc (m1) (m2) i o i f 1 4 5 6 v o v f 3 shield
TLP700 2010-02-23 2 absolute maximum ratings (ta = 25 c) characteristics symbol rating unit forward current i f 20 ma forward current derating (ta 85c) i f / ta ? 0.54 ma/c peak transient forward current (note 1) i fp 1 a reverse voltage v r 5 v led junction temperature t j 125 c ?h? peak output current i oph ? 2.0 a ?l? peak output current ta=-40 to 100 c (note 2) i opl 2.0 a output voltage v o 35 v supply voltage v cc 35 v detector junction temperature t j 125 c operating frequency (note 3) f 50 khz operating temperature range t opr ? 40 to 100 c storage temperature range t stg ? 55 to 125 c lead soldering temperature (10 s) (note 4) t sol 260 c isolation voltage (ac, 1 minute, r.h. 60%) (note 5) bv s 5000 vr m s note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: pulse width p w 1 s, 300 pps note 2: exponential waveform pulse width p w 0.3 s, f 15 khz note 3: exponential waveform i oph ? 1.5 a ( 0.3 s), i opl +1.5 a ( 0.3 s), ta=100c note 4: for the effective lead soldering area note 5: device considered a two-terminal device: pins 1, 2 and 3 paired with pins 4, 5 and 6 respectively. note 6: a cerami c capacitor (0.1 f) should be connected from pin 6 to pin 4 to stabilize the operation of the high gain linear amplifier. failure to provide the bypassing may impair the switching property. the total lead length between capacitor and coupler should not exceed 1 cm. recommended operating conditions characteristics symbol min typ. max unit input current, on (note 7) i f (on) 7.5 ? 10 ma input voltage, off v f (off) 0 ? 0.8 v supply voltage * (note 8) v cc 15 ? 30 v peak output current i oph / i opl ? ? 1.5 a operating temperature t opr ? 40 ? 100 c * this item denotes operating ranges, not m eaning of recommended operating conditions. note : recommended operating conditions are given as a design guideline to obtain expected performance of the device. additionally, each item is an independent guid eline respectively. in developing designs using this product, please confirm specified characteristics shown in this document. note 7: input signal rise time (fall time) 0.5 s. note 8: if the vcc rise slope is sharp, an internal circuit might not operate with stability. please design the vcc rise slope under 3.0 v/ s.
TLP700 2010-02-23 3 electrical characteristics (ta = ? 40 to 100 c, unless otherwise specified) characteristics symbol test circuit test condition min typ. * max unit forward voltage v f ? i f = 10 ma, ta = 25 c ? 1.57 1.75 v temperature coefficient of forward voltage ? v f /? ta ? i f = 10 ma ? ? 1.8 ? mv/c input reverse current i r ? v r = 5 v, ta = 25 c ? ? 10 a input capacitance c t ? v =0 v, f = 1 mhz, ta = 25 c ? 100 ? pf i oph1 v 6-5 = 3.5 v ? ? 1.4 ? 1.0 ?h? level i oph2 1 v cc = 15 v i f = 5 ma v 6-5 = 7 v ? ? ? 1.5 i opl1 v 5-4 = 2.5 v 1.0 1.4 ? output current (note 9) ?l? level i opl2 2 v cc = 15 v i f = 0 ma v 5-4 = 7 v 1.5 ? ? a ?h? level v oh 3 v cc1 =+15v, v ee1 =-15v r l = 200 ? , i f = 5 ma 11 13.7 ? output voltage ?l? level v ol 4 v cc1 =+15v, v ee1 =-15v r l = 200 ? ,v f = 0.8 v ? -14.9 -12.5 v ?h? level i cch 5 i f = 10 ma ? 1.3 2.0 supply current ?l? level i ccl 6 v cc = 30 v v o =open i f = 0 ma ? 1.3 2.0 ma threshold input current l h i flh ? v cc = 15 v, v o > 1 v ? 1.8 5 ma threshold input voltage h l v fhl ? v cc = 15 v, v o < 1 v 0.8 ? ? v supply voltage v cc ? ? 15 ? 30 v v uvlo+ ? v o > 2.5v, i f = 5 ma 11.0 12.5 13.5 v uvlo thresh hold v uvlo- ? v o < 2.5v, i f = 5 ma 9.5 11.0 12.0 v uvlo hysteresis uvlo hys ? ? ? 1.5 ? v ( * ): all typical values are at ta = 25c note 9: duration of io time 50 s, 1 pulse note 10: this product is more sensitive than conventional pr oducts to electrostatic discharge (esd) owing to its low power consumption design. it is therefore all the more necessary to observe general precautions regarding esd when handling this component. isolation characteristics (ta = 25 c) characteristic symbol test condition min typ. max unit capacitance input to output c s vs = 0 v , f = 1mhz (note 5) ? 1.0 ? pf isolation resistance r s r.h. 60 %, v s = 500 v (note 5) 110 12 10 14 ? ? ac, 1 minute 5000 ? ? ac, 1 second, in oil ? 10000 ? vrms isolation voltage bv s dc, 1 minute, in oil ? 10000 ? vdc
TLP700 2010-02-23 4 switching characteristics (ta = ? 40 to 100 c, unless otherwise specified) characteristics symbol test circuit test condition min typ. * max unit l h t p lh i f = 0 5 ma 50 ? 500 propagation delay time h l t p hl i f = 5 0 ma 50 ? 500 output rise time (10 ? 90 %) t r i f = 0 5 ma ? 50 ? output fall time (90 ? 10 %) t f i f = 5 0 ma ? 50 ? switching time dispersion between on and off | t p hl -t p lh | 7 v cc = 30 v r g = 20 c g = 10 nf i f = 0 ? 5 ma ? ? 250 ns common mode transient immunity at high level output cm h i f = 5 ma v o (min) = 26 v ? 15 ? ? common mode transient immunity at low level output cm l 8 v cm = 1000 vp-p ta = 25 c v cc = 30 v i f = 0 ma v o (max) = 1 v 15 ? ? kv/ s ( * ) : all typical values are at ta = 25 c. test circuit 1: i oph test circuit 2: i opl test circuit 3: v oh test circuit 4: v ol test circuit 5: i cch test circuit 6: i ccl a i opl v 5-4 v cc 1 3 4 6 0.1 f a i f 1 3 4 6 i oph v 6-5 v cc 0.1 f v cc a i cch i f 1 3 4 6 0.1 f v cc a i ccl 1 3 4 6 0.1 f v cc1 v v oh i f 1 3 4 6 0.1 f v ee1 r l v f 1 3 v cc1 v v ol 4 6 0.1 f v ee1 r l
TLP700 2010-02-23 5 test circuit 7: t p lh , t p hl , t r , t f , | t p hl -t p lh | test circuit 8: cm h , cm l cm l (cm h ) is the maximum rate of rise (fall) of the comm on mode voltage that can be sustained with the output voltage in the low (high) state. 90 % 10 % 1000 v t f t r 26v cm h 1v cm l v cm v o ? sw a: i f = 5 ma ? sw b: i f = 0 ma cm l = 800 v t r ( s) cm h = ? 800 v t f ( s) v cc 1 3 4 6 0.1 f v o rg = 20 cg = 10nf i f t p hl i f 90 % t f 50% 10 % v o t p lh t r v oh v ol 1 6 i f 3 4 0.1 f v o v cc sw a b + ? v cm (f=25khz, duty=50%, less than tr=tf=5ns)
TLP700 2010-02-23 6 i f v f S v f / S ta i f v ol ta forward voltage v f [v] ambient temperature ta [c] forward current i f [ma] low level output voltage v ol [v] coefficient S vf/S ta [m /c] v oh ta i ccl ta i cch ta forward current i f [ma] high level output voltage v oh [v] ambient temperature ta [c] ambient temperature ta [c] ambient temperature ta [c] 1 1.2 1.4 1.6 1.8 2 0.1 1 10 100 ta = - 4 0 c ta=25c ta=100c 0.1 1 10 -3.2 -2.8 -2.4 -2 -1.6 -1.2 -40-20 0 20406080100 -30 -25 -20 -15 -10 -5 0 v f =0.8v, r l =200 v cc1 =7.5v, v ee1 =-7.5v v cc1 =15v, v ee1 =-15v -40 -20 0 20 40 60 80 100 0 5 10 15 20 25 30 i f =5ma, r l =200 -40-20 0 20406080100 0 1 2 3 4 5 low level supply current i ccl [ma] i f =0ma v cc =30v -40-20 0 20406080100 0 1 2 3 4 5 high level supply current i cch [ma] i f =10ma v cc =30v v cc1 =7.5v, v ee1 =-7.5v v cc1 =15v, v ee1 =-15v
TLP700 2010-02-23 7 -40-20 0 20406080100 0 1 2 3 4 5 propagation delay time tphl, tplh [ns] propagation delay time tphl, tplh [ns] t plh , t phl ta t plh , t phl v cc t plh , t phl i f i flh ta i opl ta i oph ta ambient temperature ta [c] supply voltage v cc [v] forward current i f [ma] ambient temperature ta [c] low level peak output current i opl [a] propagation delay time tphl, tplh [ns] threshold input current i flh [ma] high level peak output current i oph [a] ambient temperature ta [c] ambient temperature ta [c] i f =5ma -40-20 0 20406080100 0 100 200 300 400 500 i f =5ma, v cc =30v r g =20 , c g =10nf tphl tplh 15 20 25 30 0 100 200 300 400 500 tphl tplh i f =5ma, r g =20 c g =10nf 4 6 8 10 12 14 16 18 20 0 100 200 300 400 500 v cc =30v r g =20 , c g =10nf v cc =15v, v o >1v i o =0ma -40-20 0 20406080100 0 1 2 3 4 5 i opl max i f =0ma, v cc =15v note 9 v 5-4 =2.5v v 5-4 =7.0v tplh tphl -40 -20 0 20 40 60 80 100 -5 -4 -3 -2 -1 0 i f =5ma, v cc =15v v 6-5 =-7.0v v 6-5 =-3.5v i oph max note 9
TLP700 2010-02-23 8 v 5-4 i opl v 6-5 i oph v o (v uvlo )** - v cc output voltage v 5-4 [v] output voltage v 6-5 [v] output voltage v o [v] low level output peak current i opl [a] high level output peak current i oph [a] supply voltage v cc [v] 0 0.5 1 1.5 2 1 2 3 4 5 6 7 -2 -1.5 -1 -0.5 0 -7 -6 -5 -4 -3 -2 -1 0 i f =0ma, v cc =15v i f =5ma, v cc =15v ta =25 c ta=100c ta =-40 c ta=100c ta =-40 c ta =25 c 0 5 10 15 20 2 4 6 8 10 12 14 +v uvlo -v uvlo uvlo hys i f =5ma, v o >2.5v v cc 1 3 4 6 i f v o **test circuit : v o (v uvlo ) - v cc note9 note9 *: the above graphs show typical characteristics.
TLP700 2010-02-23 9 soldering and storage (1) precautions for soldering 1) when using soldering reflow z an example of a temperature profile when sn-pb eutectic solder is used: z an example of a temperature profile when lead(pb)-free solder is used: z reflow soldering must be performed once or twice. z the mounting should be completed with the interval fr om the first to the last mountings being 2 weeks. 2) when using soldering flow (applicable to both eutectic solder and lead(pb)-free solder) z apply preheating of 150 deg.c for 60 to 120 seconds. z mounting condition of 260 deg.c or less within 10 seconds is recommended. z flow soldering must be performed once 3) when using soldering iron (applicable to both eutectic solder and lead(pb)-free solder) z complete soldering within 10 seconds for lead temperature not exceeding 260 deg.c or within 3 seconds not exceeding 350 deg.c. z heating by soldering iron must be only once per 1 lead
TLP700 2010-02-23 10 (2) precautions for general storage 1) do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) when transportation or storage of devices, fo llow the cautions indicated on the carton box. 3) the storage area temperature should be kept within a temperature range of 5 degree c to 35 degree c, and relative humidity should be maintained at between 45% and 75%. 4) do not store devices in the pr esence of harmful (especially corrosive)gases, or in dusty conditions. 5) use storage areas where there is minimal tem perature fluctuation. be cause rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) when repacking devices, use anti-static containers. 7) do not apply any external force or load directly to devices while they are in storage. 8) if devices have been stored for more than tw o years, even though the ab ove conditions have been followed, it is recommended that solderability of them should be tested before they are used.
TLP700 2010-02-23 11 specifications for embossed-tape packing (tp) for sdip6 type photocoupler 1. applicable package package name product type sdip6 photocouplers 2. product naming system type of package used for shipment is denoted by a symbol suffix after a produc t number. the method of classification is as below. (example) TLP700 (tp, f) [[g]]/rohs compatible (note11) tape type device name 3. tape dimensions 3.1 orientation of devices in relation to direction of tape movement device orientation in the recesses is as shown in figure 1. figure 1 device orientation 3.2 tape packing quantity: 1500 devices per reel 3.3 empty device recesses are as shown in table 1. table 1 empty device recesses standard remarks occurrences of 2 or more successive empty device recesses 0 within any given 40-mm section of tape, not including leader and trailer single empty device recesses 6 devices (max) per reel not including leader and trailer 3.4 start and end of tape: the start of the tape has 30 or more empty holes. the end of the tape has 30 or more empty holes and two empty turns only for a cover tape. tape feed
TLP700 2010-02-23 12 3.5 tape specification (1) tape material: plastic (protection against electrostatics) (2) dimensions: the tape dimensions are as shown in figure 2 and table 2. figure 2 tape forms table 2 tape dimension unit: mm unless otherwise specified: 0.1 symbol dimension remark a 10.4 ? b 5.1 ? d 7.5 center line of indented square hole and sprocket hole e 1.75 distance between tape edge and hole center f 12.0 cumulative error (max) per 10 feed holes g 4.0 cumulative error (max) per 10 feed holes k 0 4.1 internal space + 0.1 ? 0.3 + 0.1 ? 0.3 1.6 0.1 2.0 0.1 d b e fg 16.0 0.3 1.5 +0.1 ?0 0.4 0.05 4.55 0.2 k 0 a
TLP700 2010-02-23 13 3.6 reel (1) material: plastic (2) dimensions: the reel dimensions are as shown in figure 3 and table 3. figure 3 reel forms 4. packing either one reel or five reels of photoc ouplers are packed in a shipping carton. 5. label indication the carton bears a label indicating the product num ber, the symbol representing classification of standard, the quantity, the lot numbe r and the toshiba company name. 6. ordering method when placing an order, please spec ify the product number, the ctr rank , the tape type and the quantity as shown in the following example. (example) TLP700 (tp, f) 1500 pcs quantity (must be a multiple of 1500) [[g]]/rohs compatible (note 11) tape type device name note 11 :please contact your toshiba sales representative fo r details as to environmental matters such as the rohs compatibility of product. rohs is the directive 2002/95/ec of the european parliament and of the council of 27 january 2003 on the restriction of the use of certain hazardous subs tances in electrical and electronics equipment. ? a 380 2 b 80 1 c 13 0.5 e 2.0 0.5 u 4.0 0.5 w1 17.5 0.5 w2 21.5 1.0 e w1 w2 a b c u table 3 reel dimension unit: mm
TLP700 2010-02-23 14 en60747-5-2 option:(d4) attachment : specifications for en60747-5-2 option: (d4) types : TLP700, TLP700f type designations for ?option: (d4) ?, which are tested under en60747 requirements. ex.: TLP700 (d4-tp,f) d4 : en60747 option tp : standard tape & reel type f : [[g]]/rohs compatible (note 11) note: use toshiba standard type number for safety standard application. ex.: TLP700 (d4-tp,f) TLP700 en60747 isolation characteristics description symbol rating unit application classification for rated mains voltage 300v rms for rated mains voltage 600v rms i-iv i-iii ? climatic classification 40/ 100 / 21 ? pollution degree 2 ? tlpxxx type 890 maximum operating insulation voltage tlpxxxftype v iorm 1140 vpk tlpxxx type 1335 input to output test voltage, method a vpr=1.5v iorm , type and sample test tp=10s, partial discharge<5pc tlpxxxftype vpr 1710 vpk tlpxxx type 1670 input to output test voltage, method b vpr=1.875v iorm , 100% production test t p =1s, partial discharge<5pc tlpxxxftype vpr 2140 vpk highest permissible overvoltage (transient overvoltage, t pr = 60s) v tr 8000 vpk safety limiting values (max. permissible rating s in case of fault, also refer to thermal derating curve) current (input current i f , p si = 0) power (output or total power dissipation) temperature isi psi tsi 300 700 150 ma mw insulation resistance, rsi 10 12 10 11 10 9 ? =500v, ta=25c =500v, ta=100c =500v, ta=tsi v io v io v io
TLP700 2010-02-23 15 insulation related specifications 1 if a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value. (e.g.at a standard distance between soldering eye centres of 7.5mm). if this is not permissible, the user shall take suitable measures. 2 this photocoupler is suitable for ?safe electrical isolation? only within the safety limit data. maintenance of the safety data shall be ensured by means of protective circuits. marking on product for en60747 marking example 7.62mm pitch tlpxxx type 10.16mm pitch tlpxxxf type minimum creepage distance cr 7.0mm 8.0mm minimum clearance cl 7.0mm 8.0mm minimum insulation thickness ti 0.4mm comperative tracking index cti 175 4 lot.code 4 mark for option(d4) 6 4 3 1 1pin indication type name without ?tl? p700
TLP700 2010-02-23 16 figure 1 partial discharge measurement procedure according to en60747 destructive test for qualification and sampling tests. method a (for type and sampling tests, destructive tests) t 1 , t 2 t 3 , t 4 t p (measuring time for partial discharge) t b t ini v v initial (8kv) v pr (1335v for tlpxxx) (1710v for tlpxxxf) v iorm (890v for tlpxxx) (1140v for tlpxxxf) 0 t 1 t ini t 3 t 2 t p t b t 4 t = 1 to 10 s = 1 s = 10 s = 12 s = 60 s t p v pr (1670v for tlpxxx) (2140v for tlpxxxf) v iorm (890v for tlpxxx) (1140v for tlpxxxf) v t t 3 t 4 t b figure 2 partial discharge measurement procedure according to en60747 non-destructive test for100% inspection. method b (for sample test,non- destructive test) t 3 , t 4 t p (measuring time for partial discharge) t b = 0.1 s = 1 s = 1.2 s 500 400 300 200 100 0 0 25 50 75 100 125 150 175 1000 800 600 400 200 0 ta (c) isi psi isi (ma) psi ( mw ) figure 3 dependency of maximum safety ratings on ambient temperature
TLP700 2010-02-23 17 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations.

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